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High density optical interconnects integrated with lasers, optical modulators and photodetectors on a single silicon chip
| Content Provider | Semantic Scholar |
|---|---|
| Author | Urino, Yutaka Horikawa, Tsuyoshi Nakamura, T. Arakawa, Yashuhiko |
| Copyright Year | 2013 |
| Abstract | Silicon optical interposers for inter-chip interconnects, integrated with lasers, an optical splitter, optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm2 transmission density were achieved. |
| Starting Page | 1 |
| Ending Page | 3 |
| Page Count | 3 |
| File Format | PDF HTM / HTML |
| DOI | 10.1364/OFC.2013.OM2J.6 |
| Alternate Webpage(s) | http://front.sjtu.edu.cn/~llyi/waveguide/OFC2013/OM2J.6.pdf |
| Alternate Webpage(s) | https://doi.org/10.1364/OFC.2013.OM2J.6 |
| Journal | 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC) |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
