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Corrosion behavior of al–si–cu–(sn, zn) brazing filler metals
| Content Provider | Semantic Scholar |
|---|---|
| Author | Wang, S. S. Cheng, M. D. Tsao, L. Claire Chuang, Tung-Han |
| Copyright Year | 2001 |
| Abstract | Abstract The corrosion behavior of Al–Si–Cu–(Sn, Zn) filler metals in a 3.5% NaCl aqueous solution were studied using electrochemical tests. The results showed that the addition of Sn or Zn to the Al–Si–Cu filler metal raised its corrosion current density sharply and caused its corrosion potential to become more active. Sn or Zn elements exert harmful effects on such low-melting-point brazing filler metals in that the corrosion resistance is degenerated, and damage is accelerated with an increase in the Sn or Zn content. Scanning electron microscopy (SEM) micrographs of the corroded surfaces of these Al–Si–Cu–(Sn, Zn) filler metals indicate that the Al-rich phase (i.e., Al–Si, Al–Si–Cu, and Al–Si–Cu–Sn eutectic phases) dissolves preferentially, while the Si particles and CuAl 2 ( θ ) intermetallic compounds remain intact. |
| Starting Page | 401 |
| Ending Page | 409 |
| Page Count | 9 |
| File Format | PDF HTM / HTML |
| DOI | 10.1016/S1044-5803(02)00188-2 |
| Volume Number | 47 |
| Alternate Webpage(s) | http://ntur.lib.ntu.edu.tw/bitstream/246246/95919/1/60.pdf |
| Alternate Webpage(s) | https://doi.org/10.1016/S1044-5803%2802%2900188-2 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
