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Bathtub Failure Rate and Upside-down Bathtub Mean Residual Quick Inspection of Power Plane Short Fault on Multilayer Substrate. Fang-lin Chao and Ruey-beei Nondestructive Detection of Defects in Miniaturized Multilayer Ceramic Capacitors Using Digital Speckle Correlation Techniques. Electrochemical
| Content Provider | Semantic Scholar |
|---|---|
| Author | Chao, Fang-Lin Chan, Y. C. Harsányi, Gábor Gallo, Anthony A. Munamarty, Ramesh Schmidt, C. G. Simons, Jeffrey W. Kanazawa, C. H. |
| Abstract | Logic (DCVSL) are two common structures for differential BiCMOS logic family, that have several potential applications in high-speed VLSI circuits. This paper studies the fault characterization of these BiCMOS circuits. The impact of each possible single defect on the behavior of the circuits is analyzed by simulation. A new class of faults which is unique to differential circuits is identified and its testability is assessed. We propose a design-for testability method that facilitates testing of this class of faults. Two different realizations for this method are introduced. The impact of this circuit modification on the behavior of the circuit in normal mode is investigated. (l) the mean residual life (MRL) of a component has an upside-down bathtub-shape if the component has a bathtub-shape failure-rate function, but the converse does not hold; (2) there is an optimal burn-in policy to maximize the MRL when the underlying lifetime distribution has a bathtub-shape failure rate. A quick inspection approach for finding the power plane short fault on multichip modules is proposed in this paper. The current source is applied on two diagonal corners of the power plane. The location of the short fault can be determined by as few as four voltage measurements. Also, the sheet conductivity of the power plane can be obtained as a by-product. Experiments have been performed and the successful prediction of the exact short point validates the present inspection approach. The novel application of a digital speckle correlation method (DSCM) was demonstrated for the in situ and nondestructive detection of cracks in small objects such as multilayer ceramic capacitors (MLC's) in surface mount printed circuit assemblies. A combined CSCM and double lens optical arrangements was employed for the measurement of minute surface deformations in MLC's. An improved cross algorithm instead of the original full-field search method was developed based on the unimodal character of the DSCM and reduced the operation time by an order of magnitude without sacrificing the measuring accuracy. The internal cracks in MLC's that contributed to the thermal displacements on the MLC surface after the electrical loading could be uniquely identified using this improved DSCM. This technique was found to be extremely sensitive to the presence of internal cracks in MLC's of different sizes (' 1202', '0805', '0603', and '0402') created by thermal shock and has been shown to be more reliable and user-friendly than other conventional nondestructive techniques. A resolution of better than 20 … |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://www.ee.cityu.edu.hk/~ycchan/publications-ycchan/PeerReviewedJournals/PeerJournal-04.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
