NDLI: Patent Application Publication Jul . 14 , 2005 Sheet 2 of 4 US 2005 / 0153523 A 1 25

Content Provider	Semantic Scholar
Author	Sery NxSx S.
Copyright Year	2017
Abstract	Lead-free solders comprising 85-96% tin (Sn) and 4-15% Indium (In) by weight percentage (wt.%) and exemplary uses of the same are disclosed. The Sn-In Solder undergoes a martensitic phase change when it is cooled from a reflow temperature to room temperature. As a result, residual Stresses that would normally occur due to Solder Strain caused by relative movement between joined components are Substantially reduced. Typically, the relative movement results from a coefficient of thermal expansion (CTE) mis match between the joined components. The disclosed exem plary uses include flip-chip assembly and IC package to circuit board mounting, Such as ball grid array packages.
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://patentimages.storage.googleapis.com/80/53/25/986845ac6f2edd/US20050153523A1.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Patent

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