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Non-destructive extraction of width bias variations for deep sub-micron interconnect lines
| Content Provider | Semantic Scholar |
|---|---|
| Author | Tang, Mao-Chyuan Wang, Meng-Feng Cheng, Tim Chen, David Yeh, Chune-Sin Chien, S. C. |
| Copyright Year | 2007 |
| Abstract | In this paper, we propose a model of the width bias variation effect caused from non-ideal optical proximity correction (OPC) in deep sub-micron interconnect lines. By our electrical-only and non-destructive methodology, an accurate table of width bias or WEE (wire edge enlargement), which is necessary for back-end-of-line (BEOL) design on advanced deep sub-micron technology, can be fully extracted with error less than 5%. |
| Starting Page | 398 |
| Ending Page | 399 |
| Page Count | 2 |
| File Format | PDF HTM / HTML |
| DOI | 10.7567/SSDM.2007.P-2-11 |
| Volume Number | 2007 |
| Alternate Webpage(s) | https://confit.atlas.jp/guide/event-img/ssdm2007/P-2-11/public/pdf_archive?type=in |
| Alternate Webpage(s) | https://doi.org/10.7567/SSDM.2007.P-2-11 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |