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High-temperature Adhesion Promoter Based on (3-Glycidoxypropyl) Trimethoxysilane for Cu Paste
| Content Provider | Semantic Scholar |
|---|---|
| Author | Jiang, Jianwei Koo, Yong Hwan Park, Ji Hyun Kang, Hyun Suk Lee, Byung Cheol Kim, Sang-Ho Song, Hee-Eun Piao, Longhai |
| Copyright Year | 2014 |
| Abstract | E-mail: hsong@kier.re.krReceived May 27, 2014, Accepted June 20, 2014To realize copper-based electrode materials for printed electronics applications, it is necessary to improve theadhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastesusing (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cupastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> 250 |
| Starting Page | 3025 |
| Ending Page | 3029 |
| Page Count | 5 |
| File Format | PDF HTM / HTML |
| DOI | 10.5012/bkcs.2014.35.10.3025 |
| Volume Number | 35 |
| Alternate Webpage(s) | http://ocean.kisti.re.kr/downfile/volume/chemical/JCGMCS/2014/v35n10/JCGMCS_2014_v35n10_3025.pdf |
| Alternate Webpage(s) | https://doi.org/10.5012/bkcs.2014.35.10.3025 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |