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ELECTRICALLY CONDUCTIVE ADHESIVE BACKGROUND OF THE INVENTION 1. Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Author | Miyakawa, Hidenori |
| Copyright Year | 2017 |
| Abstract | The present invention provides an electrically conductive adhesive which prevents migration and Sulfuration of a metal component in electronic component mounting. The electri cally conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler par ticles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the Surface of the Ag filler particles using a metal Such as Sn. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/b9/38/77/1fb25377de6936/US7785500.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |