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Silicon micromachined sensors and sensor arrays for shear-stress measurements in aerodynamic flows
| Content Provider | Semantic Scholar |
|---|---|
| Author | Padmanabhan, Aravind |
| Copyright Year | 1996 |
| Abstract | The financial support for this research was provided by the Airforce Office of Scientific Research (contract # F49620-93-1-0194) and 3M Corporation. The SOI wafers used for the second-generation sensors were provided by Motorola Semiconductor Products Sector (Direct Wafer Bonding Group). |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://raphael.mit.edu/Technical_Reports/Padmanabhan_Thesis.pdf |
| Alternate Webpage(s) | http://dspace.mit.edu/bitstream/handle/1721.1/57600/FDRL_TR-97-5.pdf?sequence=3 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |