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The standard generalized markup language (SGML): guidelines for editors and publishers
| Content Provider | Semantic Scholar |
|---|---|
| Author | Smith, Joan M. |
| Copyright Year | 1987 |
| Abstract | A process for electrically interconnecting a group of integrated-circuit chips embedded in plastic is described. Multilayer conductors are plated in grooves photoformed in successively applied plastic layers and connected to the chip pads and to conductors on other layers through vias also photoformed in the plastic. Photoformation of wiring grooves and layer-interconnecting vias is accomplished by ultraviolet irradiation of photosensitized liquid polyester resin. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://ww6.bookmyfullmoon.com/the-standard-generalized-markup-language-sgml-guidelines-for-editors-and-publishers-file-types-epub-joan-m-smith.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
