NDLI: Ceramic Component Depost Delectric Coating Layer on Surface Layer of Ceramc Component Using Plasma Spray Process Use Component Dieectric Coating Layer Is Etched and Rucced Removeetched and Rugged Delectric Coating Layer Depost Delectric

Content Provider	Semantic Scholar
Copyright Year	2017
Abstract	Provided is a method of fabricating and repairing ceramic components for Semiconductor fabrication, through which erosion and polymer deposition occurring on ceramic com ponents for Semiconductor fabrication are decreased by modifying the dielectric Surface of a component having an electrical insulation characteristic So that the ceramic com ponents can be repaired after being used. The method includes activating a Surface layer of a component, which is manufactured by Sintering a ceramic, and depositing a dielectric coating layer on the Surface layer of the ceramic component using a plasma spray process, when the dielec tric coating layer is damaged as the ceramic component is used for Semiconductor fabrication, removing the dielectric coating layer; and repairing the ceramic component by depositing a dielectric coating layer on the Surface layer of the ceramic component from which the damaged dielectric coating layer has been removed.
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://patentimages.storage.googleapis.com/38/db/eb/df495bf3742904/US6833279.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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