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Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint
| Content Provider | Semantic Scholar |
|---|---|
| Author | He, Hongwen Cao, Liqiang Wan, Lixi Zhao, Haiyan Xu, Guangchen |
| Copyright Year | 2012 |
| Abstract | The electromigration test was conducted in Cu/Sn-58Bi/Cu solder joint with high current density of 104 A/ cm2. Results showed that a large number of whiskers with natural weed appearance were observed at the cathode side in such a short current stressing time. Furthermore, some secondary whiskers were attached to the primary whiskers, which has never been reported before. We presumed the vapor-solid (VS) mechanism to explain the oxide whiskers growth, which was quite different from the traditional theory that the compressive stress took on the driving force. In conclusion, due to the over-Joule heating effect, the metal oxide whiskers were synthesized in bulk quantities by thermal evaporation of Sn oxide and Bi oxide. |
| Starting Page | 463 |
| Ending Page | 466 |
| Page Count | 4 |
| File Format | PDF HTM / HTML |
| DOI | 10.1007/s13391-012-2019-9 |
| Volume Number | 8 |
| Alternate Webpage(s) | https://page-one.springer.com/pdf/preview/10.1007/s13391-012-2019-9 |
| Alternate Webpage(s) | https://doi.org/10.1007/s13391-012-2019-9 |
| Journal | Electronic Materials Letters |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
