NDLI: Dcing De-bonding Filmand Process for Producing Semconductor Device Field of the Invention

Content Provider	Semantic Scholar
Copyright Year	2017
Abstract	The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film has a laminated structure of a heat-expandable pressure-sensitive adhesive layer containing a foaming agent and an active energy ray-curable antifouling pressure-sensitive adhesive layer, which are laminated on the base material in this order, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semi conductor device which includes using the above-described dicing die-bonding film.
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://patentimages.storage.googleapis.com/57/a0/05/58bc5661820b9f/US20100129986A1.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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