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Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling
| Content Provider | Semantic Scholar |
|---|---|
| Author | Chandrasekar, Karthik Wilson, Jonathan Henry Erickson, Elizabeth Feng, Zhiping Xu, Jian Mick, S. Franzon, Paul D. |
| Copyright Year | 2008 |
| Abstract | Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of experiments demonstrating this capability and describes the principles behind the design of inductively coupled sockets and connectors. |
| Starting Page | 749 |
| Ending Page | 758 |
| Page Count | 10 |
| File Format | PDF HTM / HTML |
| DOI | 10.1109/TADVP.2008.2005465 |
| Volume Number | 31 |
| Alternate Webpage(s) | https://archives.ece.ncsu.edu/erl/publications/papers/paulf/2008/paulf_2008_chandrasekar.pdf |
| Alternate Webpage(s) | https://doi.org/10.1109/TADVP.2008.2005465 |
| Journal | IEEE Transactions on Advanced Packaging |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
