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Room-temperature bonding of heterogeneous materials for near-infrared image sensor
| Content Provider | Semantic Scholar |
|---|---|
| Author | Shuto, Takanori Iwanabe, Keiichiro Ogura, Mutsuo Nishida, Katsuhiko Asano, Tanemasa |
| Copyright Year | 2014 |
| Abstract | A room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared (NIR) image sensor. The image sensor is fabricated using the chip-on-chip integration of an InGaAs photodiode array on an InP substrate and a Si CMOS readout IC. The pixel pitch is 25 µm to compose quarter-VGA class (320 × 256 pixels) resolution. A high-quality imaging of a heated object is demonstrated. Bonding of the VGA array with 15 µm pitch is attempted to realize a high-resolution image sensor. |
| File Format | PDF HTM / HTML |
| DOI | 10.7567/JJAP.53.04EB01 |
| Volume Number | 53 |
| Alternate Webpage(s) | https://confit.atlas.jp/guide/event-img/ssdm2013/PS-2-3/public/pdf_archive?type=in |
| Alternate Webpage(s) | https://doi.org/10.7567/JJAP.53.04EB01 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
