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Heterogeneous integration of InGaAsP microdisk laser on a silicon platform using optofluidic assembly
| Content Provider | Semantic Scholar |
|---|---|
| Author | Tien, Ming-Chun Ohta, Aaron T. Yu, Kyoungsik Neale, Steven L. Wu, Ming C. |
| Copyright Year | 2009 |
| Abstract | Heterogeneous integration of InGaAsP microdisk lasers on a silicon platform is demonstrated experimentally using an optofluidic assembly technique. The 200-nm-thick, 5and 10-μm-diameter microdisk lasers are fabricated on InP and then released from the substrates. They are reassembled on a silicon platform using lateral-field optoelectronic tweezers (LOET). The assembled laser with 5-μm diameter exhibits a threshold pump power of 340 μW at room temperature under pulse condition. The heterogeneouslyintegrated InGaAsP-on-Si microdisk laser could provide the much needed optical source for CMOS-based silicon photonics. The small footprint and low power consumption make them attractive for optical interconnect applications. The optofluidic assembly technique enables efficient use of the III–V epitaxial materials in silicon photonic integrated |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://nanophotonics.eecs.berkeley.edu/Publications/Journal/files/2613/Tien%20et%20al.%20-%202009%20-%20Heterogeneous%20integration%20of%20InGaAsP%20microdisk%20las.pdf |
| Alternate Webpage(s) | https://cloudfront.escholarship.org/dist/prd/content/qt2m5341kq/qt2m5341kq.pdf?t=l7ogpb |
| Language | English |
| Access Restriction | Open |
| Subject Keyword | CMOS DNA Integration Diameter (qualifier value) Epitaxy Exhibits as Topic Experiment Floppy disk International System of Units Lasers Lateral Sclerosis Lateral thinking Optical interconnect Photonics Silicon |
| Content Type | Text |
| Resource Type | Article |
