brazed DIP Ceramic Side Brazed 18 brazed DIP Ceramic Side Brazed 16 brazed DIP Ceramic Side Brazed 14 brazed DIP Ceramic Side Brazed 2 PDIP Plastic

Content Provider	Semantic Scholar
Author	Valentin, Ricky Osterman, Park Michael Newman, P. B.
Abstract	This paper describes an assessment of the remaining life of solder interconnects for 13 different insertion mount packages used in an engine control electronics. The assessment consisted of using simulation to determine the mean time to failure of solder joint interconnects between the package leads and printed wiring boards under applied temperature cycle conditions. The simulation results were confirmed by accelerated testing for a 132-Pin Grid Array (PGA) and field data for a 40-lead side-brazed Dual In line Package (DIP). Loading conditions include an accelerated test condition of –45 o to 100 o C and a service loading condition of 10 o to 75 o C with an extended dwell at 60 o C. Predicted mean interconnect life expectancy ranged from 4,000 in the worst case to 130,000 cycles. Results indicate a brazed leaded ceramic dual inline package with 40 leads is likely to fail first and a 2 lead plastic encapsulated axial capacitor is the least likely to fail. The early failure of the 40-lead side-brazed DIP was confirmed by the service performance data. The service life remaining after failure of the 40-lead side-brazed DIP was estimated to be 7,800 cycles. 2. INTRODUCTION The cost of product ownership in addition to acquisition cost is a strong function of the sustainment costs associated with fielding and maintaining an electronic system [Ref. 1]. Avionic equipment usually have operational lifespan of over 20 years. During this lifespan many elements of an electronic equipment structure will degrade. If any approach the point of failure, a strategy for their replacement or refreshing during their life may be needed. In order to reduce the cost associated with fielding and maintaining of electronic system, an avionics equipment supplier must have an u nderstanding of the life expectancy of the electronic system and must be assured that the electronic system can meet the necessary life cycle requirements. Remaining life assessment provides information about the ability of a device and the interconnections made to the device to meet the device required performance specifications in its life cycle application environment for the remaining service life of the product. Traditionally, wear out life has not been a consideration and a constant assigned failure rate obtained from weighted factors has been assumed. This traditional approach includes no understanding of the behavior of materials and structures and the wear out mechanisms that may impact the service life. For a remaining life assessment …
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Alternate Webpage(s)	http://www.prognostics.umd.edu/calcepapers/03_R.Valentin_RemainngLifeAssesAgyingElectronics_AnnualReliabilityandMaintainabilityProceedings.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article