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Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for 3D System Integration
| Content Provider | Semantic Scholar |
|---|---|
| Author | Niitsu, Kiichi Kohama, Yoshinori Sugimori, Yasufumi Osada, Kenichi Irie, Naohiko Ishikuro, Hiroki Kuroda, Tadahiro |
| Copyright Year | 2008 |
| Abstract | for 3D System Integration Kiichi Niitsu, Yoshinori Kohama, Yasufumi Sugimori, Kenichi Osada, Naohiko Irie, Hiroki Ishikuro and Tadahiro Kuroda Keio University, Department of Electronics and Electrical Engineering 3-14-1, Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan Phone: +81-45-566-1779, E-mail: {kiichi, kohama, sugimori}@kuro.elec.keio.ac.jp, {ishikuro, kuroda}@elec.keio.ac.jp Hitachi Central Research Laboratory, Kokubunji, 185-8601, Japan |
| File Format | PDF HTM / HTML |
| DOI | 10.7567/SSDM.2008.D-2-4 |
| Alternate Webpage(s) | https://confit.atlas.jp/guide/event-img/ssdm2008/D-2-4/public/pdf_archive?type=in |
| Alternate Webpage(s) | https://doi.org/10.7567/SSDM.2008.D-2-4 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |