Loading...
Please wait, while we are loading the content...
Similar Documents
運動負荷試験と嫌気性代謝闘値 : 偽陽性例における検討(2) : 日本循環器学会第98回東北地方会
| Content Provider | Semantic Scholar |
|---|---|
| Author | 一彦, 牧原 佐々木, 弥生 明彦, 金澤 和夫, 鈴木 知博, 金澤 |
| Copyright Year | 1992 |
| Abstract | Thermal Curve, we’ll discuss how electronic components fail during expansion and contraction and demonstrate how to artificially induce the Thermal Curve to find expansion and contraction problems inside solid-state components. We’ll also cover some do’s and don’ts when artificially inducing the Thermal Curve. Solid state components (primarily transistors, diodes and integrated circuits (ICs)), can experience problems during expansion and contraction, yet they may operate just fine once they have reached normal operating temperature. It’s the reason behind many of the intermittent problems that seem to plague us from time to time. When you get right down to it, many intermittent problems may not be so random and unpredictable after all. In fact, any time a customer’s complaint concerns something intermittent and there is a vehicle computer or control unit involved, it means solid state component failures may be the cause. That’s when you should immediately think of the Thermal Curve. As the customer describes the problem, trace The Thermal Curve in your mind to see if the customer experiences the problem at about the same place on the Thermal Curve. If the problem always seems to have the same failure pattern, the problem may be related to a solid state component failure inside a computer or controller. In “Thermal Curves, Part One” (December 1997), we documented two personal examples of problems that were caused by temperature. These examples demonstrated the value of Thermal Curve theory because much of the vehicle’s history before the failure and after the repair was available to document the chain of events. Refer to the previous article to refresh you memory on how Thermal Curve “theory” can be applied to actual vehicle problems. When a customer’s description of a problem shows a pattern (the problem always seems to appear in the same general area of the Thermal Curve), you have some definite clues as to what is happening, when it is happening, and the conditions that are producing the problem. Armed with this information, it is more likely that you will be able to duplicate the conditions that create the problem in the shop by artificially inducing the Thermal Curve. If you are able to place the suspect electronic circuit into the same general area of the Thermal Curve, the problem will often “miraculously” appear. Well, many times it does. Then again, sometimes the problem doesn’t appear because conditions that produce the failure are very narrow and it is difficult to exactly reproduce the conditions to duplicate the problem in the shop. Applying the Thermal Curve to the problem at least provides some definite clues about the nature of the problem and explains why the problem doesn’t occur again after the faulty electronic component is |
| Starting Page | 448 |
| Ending Page | 448 |
| Page Count | 1 |
| File Format | PDF HTM / HTML |
| Volume Number | 56 |
| Alternate Webpage(s) | http://mastertechmag.com/pdf/1998/02feb/0298ThermalCurves2.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
