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Thin film thermo‐viscous damping in miniature condenser microphones
| Content Provider | Semantic Scholar |
|---|---|
| Author | Suu, Thierry Le Van Honzik, P. Durand, S. Joly, Nicolas Skvor, Zdenek Bruneau, Michael |
| Copyright Year | 2008 |
| Abstract | The thermo‐viscous damping due to the thin fluid film between the membrane and the backing electrode strongly influences both the sensitivity of the condenser microphones in the lower frequency range and the upper limit of the frequency bandwidth. Nowadays, most of the MEMs microphones use a perforated backing electrode while some authors suggest that a continuously curved backing electrode could enhance their performances (among avantages in the design when etching). The present paper provides two kinds of modeling for such microphones with a tapered fluid film: the first one lies on Kirchhoff‐network analysis (neglecting cross‐coupling between elements) whereas the second one is based upon the direct resolution of the set of basic equations (including heat transfer phenomena). The results are presented and discussed for both models in the cases of flat, parabolic, and stepped shapes backing electrode. Finally, the pressure field in the fluid film, computed (for an axisymmetrical configuration) using the... |
| Starting Page | 3229 |
| Ending Page | 3229 |
| Page Count | 1 |
| File Format | PDF HTM / HTML |
| DOI | 10.1121/1.2933453 |
| Alternate Webpage(s) | http://webistem.com/acoustics2008/acoustics2008/cd1/data/articles/002172.pdf |
| Alternate Webpage(s) | http://www.conforg.fr/acoustics2008/cdrom/data/articles/002172.pdf |
| Alternate Webpage(s) | https://doi.org/10.1121/1.2933453 |
| Volume Number | 123 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
