NDLI: Analyse de recherche: Attirer, former et retenir des enseignants efficaces: aperçu global des politiques et des pratiques actuelles

Content Provider	Semantic Scholar
Author	Moon, Bob
Copyright Year	2007
Abstract	A semiconductor device provided with a semiconductor chip having one surface bonded to a substrate, and the other surface bonded to a warp preventing sheet. Preferably, the warp preventing sheet has a coefficient of elasticity substantially equal to that of the substrate, or a coefficient of thermal expansion substantially equal to that of the substrate. Preferably, the base of the warp preventing sheet is made of material identical with that of the base of the substrate, and more preferably, the warp preventing sheet and the substrate are substantially equal in thickness to each other.
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://www.ciep.fr/sources/conferences/CD_professionnalisation/bak/pages/docs/pdf_interv/Moon_Bob_fr.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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