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FIB Applications : A Historical Perspective
| Content Provider | Semantic Scholar |
|---|---|
| Author | Stevie, Fred A. Giannuzzi, Lucille A. |
| Copyright Year | 2014 |
| Abstract | FIB applications were initially driven by the silicon semiconductor industry and concentrated on preparation for SEM and modification of devices and masks. Development of TEM preparation coupled with the site specific capability provided by FIB significantly enhanced failure analysis for Si technology and in lightwave materials such as InP [1]. Initial TEM preparation still required mechanical polishing [2], but the use of a micromanipulator to lift-out a specimen was successful on the first attempt [3]. FIG. 1 illustrates steps in this ex situ procedure to obtain a specimen from a device that had wire bonding issues and place the specimen on a carbon film TEM grid. The specimen had been cut free from the substrate to permit the lift-out. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://journals.cambridge.org/fulltext_content/supplementary/MAM20_S3/assets/7337/0294.pdf |
| Language | English |
| Access Restriction | Open |
| Subject Keyword | Biological specimen CDISC SEND Biospecimens Terminology Concentrate Dosage Form Failure analysis International System of Units LightWave 3D Masks Pyschological Bonding Semiconductor industry Semiconductors Silicon Wire bonding micromanipulator |
| Content Type | Text |
| Resource Type | Article |
