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High Delectric Strength Thermal Interface Material Background of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Author | Guarriello, John J. |
| Copyright Year | 2017 |
| Abstract | 4,566,990 1/1986 Liu et al. ................................ 252/503 4,596,670 6/1986 Liu et al. ...... ... 252/511 4,654,754 3/1987 Daszkowski. ... 361/708 4,842,911 6/1989 Fick .............. ... 428/40.4 4,869,954 9/1989 Squitieri .................................... 442/13 4,979,074 12/1990 Morley et al. ... ... 361/720 5,060,114 10/1991 Feinberg et al... ... 361/706 5,137,959 8/1992 Blocket al. ...... ... 524/430 5,151,777 9/1992 Akin et al. ... ... 257/712 5,194,480 3/1993 Blocket al. ...... ..., 524/404 5,213,868 5/1993 Liberty et al. ... ... 428/131 5,298,791 3/1994 Liberty et al. ........................ 257/707 |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/52/50/8c/90272f1477de7d/US6096414.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |