Loading...
Please wait, while we are loading the content...
Lawrence Berkeley National Laboratory Recent Work Title HEAVY-ION INDUCED ADHESION OF THIN GOLD FILMS TO OXIDIZED SUBSTRATES OF TANTALUM AND SILICON Permalink
| Content Provider | Semantic Scholar |
|---|---|
| Author | Jacobs Tserruya Sapir |
| Copyright Year | 2013 |
| Abstract | R.G. Stokstada) Department of Nuclear Physics Weizmann Institute of Science Rehovot 76100, Israel and Nuclear Science Divisionb) Lawrence Berkeley Laboratory University of California Berkeley, California 94720 P.M. Jacobs, I. Tserruya, L. Sapir, and G. Mamane Department ofNuclear Physics Weizmann Institute of Science Rehovot 76100, Israel Energetic heavy ion beams are capable of enhancing the adhesion of metallic films to a variety of substrates. Gold films (200-600 A) evaporated onto substrates of tantalum and silicon (with native oxides) were bombarded with ions of 12C, 160, 28Si, 35CI and 58Ni at 2.85 MeV /nucleon. The threshold dose required to produce a peel strength greater than the Scotchtape peel strength for a gold surface was measured as a function of ion species and angle of incidence. We observed the threshold dose to vary as the cosine of the angle with respect to normal incidence. The dependence on particle type for the Au-Ta system (with approximately [ ) -3.0±.02 40 A native oxide) was found to be Dth(cm-2) = 1017 :: for all particle beams [ ) . Au where ~~ Au is the electronic stopping power (MeV cm/mg) of the ion in gold. A substrate of 6000 A of tantalum oxide gave identical results. The value of the exponent, -3.0 ± 0.2, differs significantly from the value -1.6 ± .02 reported earlier by Tombrello, et al., for Au-Ta. ( ) -4.1 ±.03 The Au-Si system is described by Dth = 6 X I 018 ~~ Au • Auger analysis of the Au-Ta interface suggests a migration of the native oxygen as a result of ion bombardment. For the Au-Ta system. some irradiated regions that passed the Scotch-tape test just after bombardment were observed to fail when the test was repeated a few days later. Thicker gold films and higher doses resulted in longer adhesion times. These and other observations suggest that the post-irradiation decline of adhesion for Au-Ta is caused by diffusion of ambient atoms through the gold film rather than by an intrinsic time dependence of the adhesive forces. *This work was supponed in pan by the Director. Office of Energy Research. Division of Nuclear Physics of the Office of High Energy and Nuclear Physics of the U.S. Depanment of Energy under Contract No. DE-AC03-76SF00098. ' Erna and Jacob Michael Visiting Professor b permanent address |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://cloudfront.escholarship.org/dist/prd/content/qt8ks0h9v7/qt8ks0h9v7.pdf?t=p0vixu |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
