Thermal conductivity of cubic and hexagonal mesoporous silica thin films

Content Provider	Semantic Scholar
Author	Coquil, Thomas Richman, Erik K. Hutchinson, Neal J. Tolbert, Sarah H. Pilon, Laurent
Copyright Year	2009
Abstract	This paper reports the cross-plane thermal conductivity of highly ordered cubic and hexagonal templated mesoporous amorphous silica thin films synthesized by evaporation-induced self-assembly process. Cubic and hexagonal films featured spherical and cylindrical pores and average porosities of 25% and 45%, respectively. The pore diameters ranged from 3 to 18 nm and film thickness from 80 to 540 nm, while the average wall thickness varied from 3 to 12 nm. The thermal conductivity was measured at room temperature using the 3ω method. The experimental setup and the associated analysis were validated by comparing the thermal conductivity measurements with the data reported in literature for the silicon substrate and for high quality thermal oxide thin films with thicknesses ranging from 100 to 500 nm. The cross-plane thermal conductivity of the synthesized mesoporous silica thin films does not show strong dependence on pore size, wall thickness, or film thickness. This is due to the fact that heat is mainly ca...
Starting Page	034910
Ending Page	034910
Page Count	1
File Format	PDF HTM / HTML
DOI	10.1063/1.3182826
Alternate Webpage(s)	http://www.seas.ucla.edu/~pilon/Publications/DataDownloads/ThermalConductivity_mpSiO2.pdf
Alternate Webpage(s)	http://tolbert.chem.ucla.edu/Papers/Coquil_et_al-2009-Applied_Physics.pdf
Alternate Webpage(s)	http://www.seas.ucla.edu/~pilon/Publications/JAP2009.pdf
Alternate Webpage(s)	https://doi.org/10.1063/1.3182826
Volume Number	106
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article