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Manufacturing Method of Optical Devices Background of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | A first objective of the present invention is to provide a more productive method of manufacturing optical devices that minimizes processing distortion, maintains optical charac teristics Satisfactorily, and promotes Smallness. A Second objective thereof is to provide a method of manufacturing optical devices that prevents the occurrence of fine dust and maintains the optical characteristics Satisfactorily. A third objective thereof is to provide a method of manufacturing optical devices of a multi-layer configuration that are obtained by applying a Scribing/cutting method. A method of manufacturing optical devices in accordance with the present invention, wherein an optical wafer having Surfaces polished to a mirror finish is divided into a plurality of optical chips, is provided with a first Step of providing hairline cracks by a diamond blade edge in one main Surface of the optical wafer and a third Step of applying preSSure along the hairline cracks after the first Step, to divide the optical wafer into the plurality of optical chips. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/2e/19/e6/11c0a071566505/US20050170084A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Patent |