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Unraveling the Lead-Free Knot : Roadblocks and Resolutions toward a Greener Tomorrow
| Content Provider | Semantic Scholar |
|---|---|
| Author | Jorgensen, Chris |
| Copyright Year | 2000 |
| Abstract | The electronics industry has made a long-time friend of tin-lead. The electronics manufacturing industry has relied almost entirely on the use of tin-lead solder for attaching surface mount or through hole components to PWBs. SnPb solders are preferred due to their reliability, solidus/liquidus point, melting temperature, availability, cost and extensive database of use. Over the past decade, pressures from legislative and environmental groups have called for the industry to eliminate or limit the use of lead-based materials. Its genesis was The Reid Bill, proposed US legislation in 1991 that called for the elimination of lead from such household items as paint, toys, recreational game pieces, plumbing solder and fixtures and inks. When the Bill was reintroduced to the US Senate in 1993 as the Lead Exposure Reduction Act, the US electronics industry, led by IPC, fought for and won exemption from this legislation. The industry based their reasoning on the fact that there was no scientific proof that lead from electronics leaches into the water table. They also pleaded that they wouldn't have enough time to find a replacement alloy(s), all the while producing reliable, cost effective |
| Starting Page | 416 |
| Ending Page | 421 |
| Page Count | 6 |
| File Format | PDF HTM / HTML |
| DOI | 10.5104/jiep.3.416 |
| Volume Number | 3 |
| Alternate Webpage(s) | https://www.jstage.jst.go.jp/article/jiep1998/3/5/3_5_416/_pdf |
| Alternate Webpage(s) | https://doi.org/10.5104/jiep.3.416 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
