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Micro-Laser Assisted Machining (µ-LAM): Scratch Tests on 4H-SiC
| Content Provider | Semantic Scholar |
|---|---|
| Author | Patten, John Ghantasala, Muralidhar K. Shayan, Amir R. Poyraz, Huseyin Bogac Ravindra, Deepak |
| Copyright Year | 2009 |
| Abstract | In the nanomachining of semiconductors and ceramics, especially brittle materials such as silicon carbide, the presence of high pressure phase transformation is of great importance for accomplishing ductile regime machining (1). To augment the ductile regime machining of these nominally brittle materials, the high pressure phase can be preferentially heated and thermally softened by using concentrated energy sources such as laser beams (2). Notably, the results of scratch tests at 1µm/sec show a doubling of the scratch depth which suggests a ~40% reduction of calculated relative hardness due to thermal softening by the laser heating. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://wmich.edu/mfe/mrc/pdf/Micro-Laser%20Assisted%20Machining%20(Scratch%20Tests%20on%204H-SiC).pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
