BGA Repair : A Better Understanding can Reduce Fears , Guarantee Process Control and Save Money

Content Provider	Semantic Scholar
Author	Cannon, Mark J.
Copyright Year	2002
Abstract	Page 1 06.08.2001.ca-dy Current international studies reinforce the global trend to area array pakkages. BGA, CSP and Flip Chip technology not only offer significantly more I/Os (input/output) per mm2 of PCB real estate; they also have distinct electrical, mechanical, and unit cost advantages. Increased density, reduced feature size and packaging all add up to shorter distances for signals to travel, hence increasing speed and performance. See Figure 1. Consequently, there is no mystery in the dramatic increase in numbers of Flip Chip and advanced packages expected for 2002, arriving at nearly 2 billion in the year 2003. See Figure 2. Advances in production equipment have allowed for an acceptable ppm failure rate during the production process. For many, however, the concept of quality repair remains an expensive nightmare. A more thorough understanding of the area array package and the production parameters can reduce fears of BGA repair, guarantee process control, and greatly save in rework costs.
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Language	English
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Resource Type	Article