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Interfacial Interaction of Nickel with Liquid Pb-free Sn-Bi-In-Zn-Sb Soldering Alloys
| Content Provider | Semantic Scholar |
|---|---|
| Author | Barmak, Katayun Berry, David Carson Sidorko, Volodymyr Samelyuk, A. V. Dybkov, Vasyl I. |
| Copyright Year | 2007 |
| Abstract | Dissolution kinetics of nickel in liquid 87.5% Sn-7.5% Bi-3% In-1% Zn-1% Sb and 80% Sn-15% Bi-3% In-1% Zn-1% Sb soldering alloys and phase formation at the Ni-solder interface have been investigated at 250-450°C. The temperature dependence of the nickel solubility in soldering alloys was found to obey a relation of the Arrhenius type cs = 4.94 × 10 exp (– 39500/RT) % for the former alloy and cs = 4.19 × 10 exp (–40200/RT) % for the latter, where R is in J mol K and T in K. The dissolution rate constants are rather close for these alloys and vary in the range (1-9) × 10 m s at disc rotational speeds of 6.45 to 82.4 rad s. With both alloys, the Ni3Sn4 intermetallic layer is formed at the interface of nickel and the saturated or undersaturated melt at holding times up to 2400 s. A simple mathematical equation is proposed to evaluate the Ni3Sn4 layer thickness in the case of undersaturated melts. The tensile strength of the Ni-to-alloy joints is 94-102 MPa. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://dybkov.kiev.ua/V/JOUR/Ni_MST_07_525.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
