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3D interconnected porous NiMoO4 nanoplate arrays on Ni foam as high-performance binder-free electrode for supercapacitors
| Content Provider | Semantic Scholar |
|---|---|
| Author | Huang, Liang Xiang, Jingwei Zhang, Wei Chen, Chaoji Xu, Henghui Huang, Yunhui |
| Copyright Year | 2015 |
| Abstract | 3D interconnected NiMoO4 nanoplate arrays (NPAs) are grown on Ni foam (NPAs@Ni) via a facile hydrothermal reaction. The obtained NPAs@Ni is directly used as a binder-free integrated electrode for supercapacitors. The optimized electrode exhibits a specific capacitance as high as 3.4 F cm−2 (2138 F g−1) at a current density of 2 mA cm−2, and an excellent cyclability with 87% retention of the initial specific capacitance after 3000 cycles. The remarkable electrochemical performance can be attributed to the interconnected architecture in which the electrons and ions readily transport along the conductive 3D channels. |
| Starting Page | 22081 |
| Ending Page | 22087 |
| Page Count | 7 |
| File Format | PDF HTM / HTML |
| DOI | 10.1039/C5TA05644F |
| Alternate Webpage(s) | http://www.rsc.org/suppdata/c5/ta/c5ta05644f/c5ta05644f1.pdf |
| Alternate Webpage(s) | https://doi.org/10.1039/C5TA05644F |
| Volume Number | 3 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
