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DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2012 |
| Abstract | Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering is a process that can deposit TiO2 material on wafer/glass substrates. In this process target is connected to negative high voltage. Further argon gas is introduced into the chamber and is ionized to a positive charge. The positively charged argon atoms are attracted and strike the negatively biased target. The sputtered atoms and molecules scatter in the chamber and out of which some comes to rest on the wafer. A principal feature of a sputtering process is that the target material is deposited on the wafer without chemical or compositional change. In the present work, DC sputtering techniques has been used: |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://shodhganga.inflibnet.ac.in/bitstream/10603/44513/12/12_chapter%204.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
