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Abnormal ESD failure mechanism in high-pin-count BGA packaged ICs due to stressing nonconnected balls
| Content Provider | Semantic Scholar |
|---|---|
| Author | Lo, Wen-Yu Ker, Ming-Dou |
| Copyright Year | 2004 |
| Abstract | An abnormal failure mechanism due to ESD pulse applied on the nonconnected (NC) solder balls of a high-pin-count (683 balls) BGA packaged chipset IC is presented. The ESD test results of the IC product were found below human-body-model (HBM) 2 kV when stressing all balls or only stressing NC balls, but above HBM 3 kV when stressing all balls excluding NC balls. Failure analyses, including scanning electron microscopy (SEM) photographs and the measurement of current waveforms during ESD discharging event, have been performed. With a new proposed equivalent model, a clear explanation on this unusual phenomenon is found to have a high correlation to the small capacitor method (SCM). Several solutions to overcome this failure mechanism are also discussed. |
| Starting Page | 24 |
| Ending Page | 31 |
| Page Count | 8 |
| File Format | PDF HTM / HTML |
| Volume Number | 4 |
| Alternate Webpage(s) | http://www.ics.ee.nctu.edu.tw/~mdker/Referred%20Journal%20Papers/2004%20BGA.pdf |
| Journal | IEEE Transactions on Device and Materials Reliability |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
