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Imaging and Characterization of Thick Production-Line Microelectronic Components using Transmission Acoustic Microscopy
| Content Provider | Semantic Scholar |
|---|---|
| Author | Tsai, Chen S. Wang, Jung K. Lee, Chin C. |
| Copyright Year | 1979 |
| Abstract | The interfacial regions of four types of production-line microelectronic components (die-bonded transistor headers, high power silicon transistors, chip-resistors, and multilayer chip-capacitors) have been examined using a transmission scanning acoustic microscope operating at 150 MHz and a combination of modes. Flaws, voids, and defects in these components have been detected. Some characterization of these defects has also been obtained. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://lib.dr.iastate.edu/cgi/viewcontent.cgi?article=1042&context=cnde_yellowjackets_1978&httpsredir=1&referer= |
| Alternate Webpage(s) | http://lib.dr.iastate.edu/cgi/viewcontent.cgi?article=1042&context=cnde_yellowjackets_1978 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |