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Downlink performance and complexity evaluation of equalisation strategies for an MC-CDMA ‘4G’ physical layer candidate
| Content Provider | Semantic Scholar |
|---|---|
| Author | Cooper, Ma Armour, Simon Mcgeehan, J. P. |
| Copyright Year | 2003 |
| Abstract | A semiconductor device having a heat radiating member and a laminated structure for improvements in electrical and heat radiating characteristics. The heat radiating member is partially exposed outside a resin package of the semiconductor device to radiate heat generated by a semiconductor element to the outside of the device. In the laminated structure, a capacitor having a small capacity is formed by two electrically conductive plates one of which is connected to power supply leads and the other of which is connected to a grounded portion of the semiconductor element and to a grounding lead. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://research-information.bristol.ac.uk/files/2990349/Cooper_IEEE_SCVT_Nov2003.pdf |
| Alternate Webpage(s) | https://research-information.bris.ac.uk/files/2990349/Cooper_IEEE_SCVT_Nov2003.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |