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High performance RF-microwave multilayer integrated components for wireless applications
| Content Provider | Semantic Scholar |
|---|---|
| Author | Amin, Yasar Tenhunen, Hannu Jamal, Habibullah Zheng, Li-Rong Duo, Xinzhong |
| Copyright Year | 2005 |
| Abstract | Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5GHz require low power and high quality integrated transceiver solutions. The integration of RF front-end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module for 5GHz wireless LAN applications is implemented using benzocyclobutene (BCB) as interlayer material. |
| Starting Page | 29 |
| Ending Page | 29 |
| Page Count | 1 |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://www.wseas.us/e-library/conferences/2005salzburg/papers/492-360.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
