NDLI: Development of Halogen Free , Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer

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Development of Halogen Free , Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer

Content Provider	Semantic Scholar
Author	Qiang, Yang
Copyright Year	2016
Abstract	With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL’s, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. The main flame retardants used in halogen-free CCL’s are phosphorus-containing phenolic resins, phosphonitriles, phosphorus containing epoxy resins, and several additive type compounds. Flame retardant additives like phosphates have low or no reactivity with epoxy resins, which typically results in lower glass transition temperature (Tg), higher moisture absorption, reduced dielectric performance and lower heat resistance. This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented. The significance of this paper is not only to introduce a new halogen-free, mid-Tg, low loss CCL, but also to highlight a novel kind of halogen free reactive flame retardant for CCL. Comparison performance data to other commercial halogen-free base materials will be presented.
File Format	PDF HTM / HTML
Alternate Webpage(s)	https://smtnet.com/library/files/upload/copper-clad-laminates.pdf
Language	English
Access Restriction	Open
Content Type	Text
Resource Type	Article

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