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Wire-bonded through-silicon vias with low capacitive substrate coupling
| Content Provider | Semantic Scholar |
|---|---|
| Author | Fischer, Andreas Grange, Matthew Roxhed, Niclas Weerasekera, Roshan Pamunuwa, Dinesh Stemme, Göran Niklaus, Frank |
| Copyright Year | 2011 |
| Abstract | Three-dimensional integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies with through-silicon vias (TSVs). They enable the rea ... |
| Starting Page | 085035 |
| Ending Page | 085035 |
| Page Count | 1 |
| File Format | PDF HTM / HTML |
| DOI | 10.1088/0960-1317/21/8/085035 |
| Alternate Webpage(s) | http://kth.diva-portal.org/smash/get/diva2:434694/FULLTEXT01 |
| Alternate Webpage(s) | https://doi.org/10.1088/0960-1317%2F21%2F8%2F085035 |
| Volume Number | 21 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |