NDLI: Modification of epoxy resins with polysiloxane TPU for electronic encapsulation. II

Content Provider	Scilit
Author	Ho, Tsung-Han Wang, Jenn-Hwa Wang, Chun-Shan
Copyright Year	1996
Description	Journal: Journal of Applied Polymer Science
Related Links	https://onlinelibrary.wiley.com/doi/pdf/10.1002/(SICI)1097-4628(19960523)60:8<1097::AID-APP3>3.0.CO;2-G
Ending Page	1107
Page Count	11
Starting Page	1097
ISSN	00218995
e-ISSN	10974628
DOI	10.1002/%28sici%291097-4628%2819960523%2960%3A8%3C1097%3A%3Aaid-app3%3E3.0.co%3B2-g
Journal	Journal of Applied Polymer Science
Issue Number	8
Volume Number	60
Language	English
Publisher	Wiley-Blackwell
Publisher Date	1996-05-23
Access Restriction	Open
Subject Keyword	Journal: Journal of Applied Polymer Science Epoxy Resin
Content Type	Text
Resource Type	Article
Subject	Chemistry Surfaces, Coatings and Films Materials Chemistry Polymers and Plastics

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Modification of epoxy resins with polysiloxane TPU for electronic encapsulation. II