Loading...
Please wait, while we are loading the content...
Similar Documents
A study on the diamond grinding of ultra-thin silicon wafers
Content Provider | Scilit |
---|---|
Author | Zhou, L. Tian, Y. B. Huang, Han Sato, H. Shimizu, J. |
Copyright Year | 2011 |
Related Links | http://pib.sagepub.com/content/226/1/66.full.pdf |
Ending Page | 75 |
Page Count | 10 |
Starting Page | 66 |
ISSN | 09544054 |
e-ISSN | 20412975 |
DOI | 10.1177/0954405411414768 |
Journal | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture |
Issue Number | 1 |
Volume Number | 226 |
Language | English |
Publisher | SAGE Publications |
Publisher Date | 2011-08-08 |
Access Restriction | Open |
Subject Keyword | Journal: Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture Automotive Engineering Manufacturing Engineering Silicon Wafer |
Content Type | Text |
Resource Type | Article |
Subject | Industrial and Manufacturing Engineering Mechanical Engineering |