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Effect of Growth Rate and Wafering on Residual Stress of Diamond Wire Sawn Silicon Wafers
| Content Provider | Scilit |
|---|---|
| Author | Kumar, Arkadeep Prasath, R. G. R. Pogue, Vanessa Skenes, Kevin Yang, Chris Melkote, Shreyes N. Danyluk, Steven |
| Copyright Year | 2016 |
| Description | Journal: Procedia Manufacturing |
| Related Links | https://core.ac.uk/download/pdf/82589505.pdf |
| Ending Page | 1393 |
| Page Count | 12 |
| Starting Page | 1382 |
| ISSN | 23519789 |
| DOI | 10.1016/j.promfg.2016.08.108 |
| Journal | Procedia Manufacturing |
| Volume Number | 5 |
| Language | English |
| Publisher | Elsevier BV |
| Publisher Date | 2016-01-01 |
| Access Restriction | Open |
| Subject Keyword | Journal: Procedia Manufacturing Diamond Wire Sawing Multi-crystalline Silicon |
| Content Type | Text |
| Resource Type | Article |