Composite materials for Hi-Tech printed circuit boards

Content Provider	Scilit
Author	Medvedev, A. M.
Copyright Year	2019
Description	Journal: Iop Conference Series: Materials Science and Engineering The development of printed circuit board technology is subject to the general trend of electronics development - an increase in functionality and performance. This requires printed circuit boards to increase the assembly density of electronic components and interconnections and reduction of constructive delays in transmission lines of information. In turn, this requires the use of base materials with good dimensional stability and reduced values of dielectric permittivity and dielectric losses. Operability of gigabit electronics largely depends on the state of the surface of the printed conductors, since at high frequencies it is affected by the skin effect. Producers of basic materials, trying to meet these requirements, remain in the field of composite materials, so as not to change the structure of the existing production, based on the use of basic technologies of printed circuit boards. This article is based on the presentation of the properties of new materials from the catalogs of the companies Panasonic, Hitachi (Japan) and Isola (Germany).
Related Links	https://iopscience.iop.org/article/10.1088/1757-899X/675/1/012044/pdf
ISSN	17578981
e-ISSN	1757899X
DOI	10.1088/1757-899x/675/1/012044
Journal	Iop Conference Series: Materials Science and Engineering
Issue Number	1
Volume Number	675
Language	English
Publisher	IOP Publishing
Publisher Date	2019-11-01
Access Restriction	Open
Subject Keyword	Journal: Iop Conference Series: Materials Science and Engineering Composite Materials Printed Circuit Boards Printed Circuit Board Technology
Content Type	Text
Resource Type	Article