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Application of metallic inks based on nickel-silver core–shell nanoparticles for fabrication of conductive films
| Content Provider | Scilit |
|---|---|
| Author | Pajor-Świerzy, Anna Socha, Robert Pawłowski, Radosław Warszyński, Piotr Szczepanowicz, Krzysztof Piotr |
| Copyright Year | 2019 |
| Description | Journal: Nanotechnology Conductive inks based on nickel nanoparticles (NPs) have attracted much attention as a low-cost replacement for the currently used silver and gold inks for fabrication of printed electronic circuits and devices. Nickel NPs as a component of conductive inks should be stable against oxidation process at all stages of preparation of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, the oxidation resistance of the Ag layer and the conductive properties of the Ni core allowed to use nickel-silver core-shell (Ni@Ag) NPs as the component of conductive ink. Thick films composed of Ni-Ag core-shell NPs were deposited on a glass substrate and then sintered at temperatures ranging from 250°C to 370°C. The conductivity of Ni@Ag coatings after sintering at 350°C reached 11% of that for a bulk nickel. |
| Related Links | http://iopscience.iop.org/article/10.1088/1361-6528/ab0467/pdf |
| ISSN | 09574484 |
| e-ISSN | 13616528 |
| DOI | 10.1088/1361-6528/ab0467 |
| Journal | Nanotechnology |
| Issue Number | 22 |
| Volume Number | 30 |
| Language | English |
| Publisher | IOP Publishing |
| Publisher Date | 2019-02-05 |
| Access Restriction | Open |
| Subject Keyword | Journal: Nanotechnology Conductive Ink |
| Content Type | Text |
| Resource Type | Article |
| Subject | Chemistry Nanoscience and Nanotechnology Mechanics of Materials Mechanical Engineering Bioengineering Electrical and Electronic Engineering |
