NDLI: High critical current density in Cu/Ag composited sheathed $Ba_{0.6}K_{0.4}Fe_{2}As_{2}$ tapes prepared via hot isostatic pressing

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High critical current density in Cu/Ag composited sheathed $Ba_{0.6}K_{0.4}Fe_{2}As_{2}$ tapes prepared via hot isostatic pressing

Content Provider	Scilit
Author	Liu, Shifa Cheng, Zhe Yao, Chao Dong, Chiheng Wang, Dongliang Huang, He Li, Liu Xu, Guangxian Zhu, Yanchang Liu, Fang Liu, Huajun Ma, Yanwei
Copyright Year	2019
Description	Journal: Superconductor Science and Technology Iron-based superconductors (IBSs) with ultrahigh upper critical fields and low anisotropies have attracted significant attention in terms of the novel mechanism of superconductivity and high field applications. A major concern for practical research is the fabrication of long wires with enhanced critical current density and low cost. In this paper, Cu/Ag composited sheathed Ba0.6K0.4Fe2As2 (Ba122) tapes were fabricated through a hot isostatic pressing (HIP) method, which is feasible for long wire manufacturing. The Cu/Ag composite sheath can lower the tape cost by reducing the use of expensive Ag. A high transport critical current density (Jc) up to 5.8×104 A cm-2 under 10 T at 4.2 K was achieved in our tapes. Evidences have showed that these tapes have pure Ba122 phase, homogeneous element distribution, orientated grains and good grain connectivity. Our work shows that low cost Cu/Ag-sheathed IBS tapes are of great promise for practical applications in the future.
Related Links	http://iopscience.iop.org/article/10.1088/1361-6668/aaff27/pdf
ISSN	09532048
e-ISSN	13616668
DOI	10.1088/1361-6668/aaff27
Journal	Superconductor Science and Technology
Issue Number	4
Volume Number	32
Language	English
Publisher	IOP Publishing
Publisher Date	2019-01-16
Access Restriction	Open
Subject Keyword	Journal: Superconductor Science and Technology Metallurgy and Metallurgical Engineering Critical Current Density
Content Type	Text
Resource Type	Article
Subject	Ceramics and Composites Materials Chemistry Metals and Alloys Condensed Matter Physics Electrical and Electronic Engineering

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