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CBCA: Consignment based communal authentication and encryption scheme for Internet of things using Digital Signature Algorithm
| Content Provider | Scilit |
|---|---|
| Author | Arun, . M. Praveenkumar, . S. Rajakumar, .P. S. Thamizhikkavi, . P. |
| Copyright Year | 2021 |
| Description | Journal: Iop Conference Series: Materials Science and Engineering IoT (Internet of things) gives a dream that communicate the extent of web by incorporating physical articles to distinguish themselves among the participating people. This contemporary observation encourages physical objects to represent them in the advanced world. There are heaps of hypotheses and future conjecture about different physical substances associated with the web, programs, Most of the devices needs security features from the wide range of attacks that are present in the environment. The computationally complex and asset expending methods have a restricted support over these installed physical objects and miniature sensor hubs. In this paper we propose a CBCA (Consignment based communal authentication) conspire for real objects that are moderately associated with the IoT condition. Client server correspondence model is used by present reality substances to communicate with each other. In our proposed framework we use lightweight features of CoAP(Constrained Application Protocol) to screen servers, regardless of whether the assets from the server are empowered on client in a vitality proficient way. Digital signature algorithm (DSA) with a key length of 512 bits is used to set up a protected meeting for the resource assessment. Our plan is assessed for real world situation utilizing NetDuino Plus 2 sheets. Our proposed framework gives an overwhelming obstruction against various attacks and its computationally proficient, get less association overhead simultaneously. |
| Related Links | https://iopscience.iop.org/article/10.1088/1757-899X/1074/1/012003/pdf |
| ISSN | 17578981 |
| e-ISSN | 1757899X |
| DOI | 10.1088/1757-899x/1074/1/012003 |
| Journal | Iop Conference Series: Materials Science and Engineering |
| Issue Number | 1 |
| Volume Number | 1074 |
| Language | English |
| Publisher | IOP Publishing |
| Publisher Date | 2021-02-01 |
| Access Restriction | Open |
| Subject Keyword | Journal: Iop Conference Series: Materials Science and Engineering Hardware and Architecture Digital Signature Algorithm |
| Content Type | Text |
| Resource Type | Article |
