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Modelling and Optimization of Copper Electroplating Adhesion Strength
| Content Provider | Scilit |
|---|---|
| Author | Suryanto Haider, Farag I. Ani, Mohd Hanafi Mahmood, M. H. |
| Copyright Year | 2017 |
| Description | Journal: Iop Conference Series: Materials Science and Engineering In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of $CuSO_{4}$ and $H_{2}SO_{4}$ concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation can be used to predict the adhesion strength of the copper coatings on stainless steel substrate of electroplating parameters in ranges of $CuSO_{4}$ 100 to 200 g / L, $H_{2}SO_{4}$ 100 to 200 g / L and current density 40 to 80 mA / $cm^{2}$. The results showed that, operating condition should be controlled at 200 g/L CuSO4, 100 g/L H2SO4 and 80 $mA/cm^{2}$, to obtain the maximum adhesion strength 10N. |
| Related Links | http://iopscience.iop.org/article/10.1088/1757-899X/204/1/012017/pdf |
| ISSN | 17578981 |
| e-ISSN | 1757899X |
| DOI | 10.1088/1757-899x/204/1/012017 |
| Journal | Iop Conference Series: Materials Science and Engineering |
| Volume Number | 204 |
| Language | English |
| Publisher | IOP Publishing |
| Publisher Date | 2017-05-25 |
| Access Restriction | Open |
| Subject Keyword | Journal: Iop Conference Series: Materials Science and Engineering Coatings and Films Response Surface Methodology Adhesion Strength Current Densities Modelling and Optimize |
| Content Type | Text |
| Resource Type | Article |
