NDLI: Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates

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Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates

Content Provider	Scilit
Author	Sridhar, A. Reiding, J. Adelaar, H. Achterhoek, F. Dijk, D. J. Van Akkerman, Remko
Copyright Year	2009
Description	Journal: Journal of Micromechanics and Microengineering In this paper, a method to fabricate radio frequency (RF) circuit structures is described. This method involves inkjet printing of a silver nanoparticle-based ink on a functional substrate material to create the seed track (i.e., the seed layer), onto which copper is subsequently deposited by an electroless plating method, to obtain the desired thickness and conductivity of the RF structures. This process combination was validated by fabricating an S-band filter on a high-frequency substrate and comparing the RF performance of this filter with that of a filter fabricated using the conventional lithography-based method. The adhesion of the circuit structures to the substrate was qualitatively ascertained by the scotch tape test method. The performance of the inkjet-printed–electroless-plated filter was comparable to that of the conventional filter, thus proving the suitability of this novel method for practical RF applications.
Related Links	http://iopscience.iop.org/0960-1317/19/8/085020/pdf/0960-1317_19_8_085020.pdf
ISSN	09601317
e-ISSN	13616439
DOI	10.1088/0960-1317/19/8/085020
Journal	Journal of Micromechanics and Microengineering
Issue Number	8
Volume Number	19
Language	English
Publisher	IOP Publishing
Publisher Date	2009-07-14
Access Restriction	Open
Subject Keyword	Journal: Journal of Micromechanics and Microengineering Circuit Structures Electroless Plating Frequency Substrates
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Mechanics of Materials Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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