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8Chapter Heat Conduction Equation
| Content Provider | Scilit |
|---|---|
| Author | Shabany, Younes |
| Copyright Year | 2009 |
| Description | So far the Fourier's law of heat conduction, first introduced in Chapter 4, Section 4.1, has been used to calculate conduction heat transfer rate in a medium. This approach is reasonably accurate, and provides good first-order engineering approximations, in cases where heat conduction is mainly one-dimensional and there is no heat generation in the medium. Conduction heat transfer through the length of a thin fin, in the base of a heat sink that is the same size as the electronic device it is mounted on, and through the interface material inserted between a heat sink and an electronic package are examples in which this approach is reasonably accurate. However, there are other situations that either one-dimensional heat conduction assumption is not valid or there is heat generation in the medium. Conduction heat transfer in a heat spreader attached to a much smaller die, inside a foil heater with electrical joule heating, and in a printed circuit board are examples in which this simple approach will give erroneous results. Book Name: Heat Transfer |
| Related Links | https://content.taylorfrancis.com/books/download?dac=C2009-0-02430-6&isbn=9780429092220&doi=10.1201/9781439814680-11&format=pdf |
| Ending Page | 224 |
| Page Count | 40 |
| Starting Page | 185 |
| DOI | 10.1201/9781439814680-11 |
| Language | English |
| Publisher | Informa UK Limited |
| Publisher Date | 2009-12-17 |
| Access Restriction | Open |
| Subject Keyword | Book Name: Heat Transfer Manufacturing Engineering Heat Conduction Conduction Heat Transfer |
| Content Type | Text |
| Resource Type | Chapter |
