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Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy
| Content Provider | Scilit |
|---|---|
| Author | Alam, S. N. Jindal, N. Naithani, N. |
| Copyright Year | 2019 |
| Abstract | The present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both binary eutectic Sn-57 wt.% Bi and ternary Sn-(57-x)Bi-xCu (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) alloys containing various amounts of Cu were developed by melting casting route. The microstructure of the various solder alloys was analyzed using an optical microscope and a SEM. The variation in melting point, hardness and electrical resistivity of the Sn-Bi eutectic solder alloys with the addition of Cu was determined. The melting point of the eutectic Sn-Bi solder alloy was found to decrease up to the addition of 0.7 wt.% Cu. However, further addition of Cu led to an increase in the melting point of the alloy. Addition of Cu led to an increase in the hardness of the eutectic Sn-Bi solder alloy whereas the electrical resistivity of this alloy was found to increase up to the addition of 0.7 wt.% of Cu beyond which a decrease in the electrical resistivity was observed. A change in the microstructure of the solder alloy was observed when it was reheated above the melting temperature. |
| Related Links | https://content.sciendo.com/downloadpdf/journals/msp/37/2/article-p212.pdf https://content.sciendo.com/downloadpdf/journals/msp/ahead-of-print/article-10.2478-msp-2019-0032.pdf |
| Ending Page | 224 |
| Page Count | 13 |
| Starting Page | 212 |
| ISSN | 20831331 |
| e-ISSN | 2083134X |
| DOI | 10.2478/msp-2019-0032 |
| Journal | Materials Science-Poland |
| Issue Number | 2 |
| Volume Number | 37 |
| Language | English |
| Publisher | Walter de Gruyter GmbH |
| Publisher Date | 2019-06-01 |
| Access Restriction | Open |
| Subject Keyword | Materials Science-poland Condensed Matter Physics Electrical Resistivity Eutectic Sn Bi Addition of Cu Journal: Materials Science-Poland, Issue- 2 |
| Content Type | Text |
| Resource Type | Article |
| Subject | Mechanics of Materials Condensed Matter Physics Materials Science Mechanical Engineering |
