NDLI: 3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance

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3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance

Content Provider	Scilit
Author	Xiao, Pengcheng Liu, Zengxun Zhu, Liguang Wang, Zepeng Piao, Zhanlong
Copyright Year	2018
Abstract	A novel 3D conductive heat transfer model was developed based on node temperature inheritance. Heat transfer of the mold and billet could be analyzed synchronously. In the model, heat transfer in the copper wall was in a steady state, whereas heat transfer in the billet was in a transient state. The temperature distribution indicated that the maximum temperature on the copper wall reached approximately 30 mm below the meniscus. The results were in better agreement with industrially measured data than those of traditional 2D heat transfer models. The model was applied to study the effect of water scale on heat transfer of a billet mold. When the scale thickness increased from 0 to 0.5 mm, the maximum temperature on the copper wall increased from 174 °C to 364 °C, which will lead to mold deformation and peeling of the coating. In addition, the shell thickness slightly decreased with increasing scale thickness.
Related Links	http://www.degruyter.com/downloadpdf/j/htmp.ahead-of-print/htmp-2018-0026/htmp-2018-0026.xml
ISSN	03346455
e-ISSN	21910324
DOI	10.1515/htmp-2018-0026
Journal	High Temperature Materials and Processes
Issue Number	2019
Volume Number	38
Language	English
Publisher	Walter de Gruyter GmbH
Publisher Date	2019-02-25
Access Restriction	Open
Subject Keyword	High Temperature Materials and Processes Manufacturing Engineering 3d Heat Transfer Continuous Casting Mold Finite-element Analysis Copper Scale Journal: High Temperature Materials and Processes, Issue- 4
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Physical and Theoretical Chemistry Condensed Matter Physics Materials Science

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