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Effect of copper oxide shell thickness on flash light sintering of copper nanoparticle ink

Content Provider	Royal Society of Chemistry (RSC)
Author	Oh, Gyung-Hwan Hwang, Hyun-Jun Kim, Hak-Sung
Copyright Year	2017
Abstract	In this study, the effect of the thickness of a copper oxide-shell on flash light sintering of Cu nanoparticles (NPs) was investigated. The electrical properties of Cu nano-ink films with various oxide-shell thicknesses were examined by measuring the sheet resistance. Furthermore, the amount of PVP in the Cu NP-ink was varied to reduce the copper oxide-shell efficiently and enhance the flash light sintering of the Cu NPs. Also, to investigate the reduction and sintering phenomena of Cu NPs with respect to the copper oxide shell thickness, the sheet resistances of the Cu films were measured in real-time using an in situ resistance measuring system during the flash light sintering process. The results of this study established the maximum allowable thickness of the copper oxide shell that allows flash light sintering and also provided the optimal amount of PVP in Cu nano-ink for a particular copper oxide shell thickness.
Starting Page	17724
Ending Page	17731
Page Count	8
File Format	HTM / HTML PDF
ISSN	20462069
Volume Number	7
Issue Number	29
Journal	RSC Advances
DOI	10.1039/c7ra01429e
Language	English
Publisher	Royal Society of Chemistry
Access Restriction	Open
Subject Keyword	Sintering Sheet resistance PVP Copper Copper oxide
Content Type	Text
Resource Type	Article
Subject	Chemistry Chemical Engineering

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